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Heat Pipe Vapor Cooling Etched Silicon Structure

IP.com Disclosure Number: IPCOM000044925D
Original Publication Date: 1983-Jan-01
Included in the Prior Art Database: 2005-Feb-06

Publishing Venue

IBM

Related People

Authors:
Eldridge, JM Petersen, KE [+details]

Abstract

This structure for cooling an integrated circuit semiconductor chip comprises a heat pipe, a silicon circuit chip, and a (110) silicon wafer arranged to be bonded to the reverse side of the circuit chip, and having anisotropically etched grooves on the reverse side remote from the circuit chip over which the heat pipe structure is arranged. Wicking material lining the heat pipe and contacting the grooves is saturated with a low boiling-point, high surface-tension liquid for vapor cooling the silicon wafer and the attached circuit chip.