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Polyimide as an Insulation Layer

IP.com Disclosure Number: IPCOM000044937D
Original Publication Date: 1983-Jan-01
Included in the Prior Art Database: 2005-Feb-06

Publishing Venue

IBM

Related People

Authors:
Agnihotri, RK Kluge, HC [+details]

Abstract

The conductor metallurgy can be coated with a polyimide layer on thin film magnetic heads. The polyimide can be partially cured and coated with a photoresist to etch the polyimide layer. A photosensitive polyimide can be directly exposed, developed and cured to form the required patterns.