Original Publication Date: 1983-Jan-01
Included in the Prior Art Database: 2005-Feb-06
In the packaging of certain semiconductor chips, it is necessary to secure a substrate, with a chip and stacking pins thereon, to another substrate having the necessary I/O pins. One technique is to place one substrate on top of another substrate with the pins of the top substrate aligned with the pin heads on the bottom substrate. The pins on the top substrate are prepared by solder/fluxing the pins that will be placed on pin heads of the bottom substrate. This structure is then heated to cause the solder to melt and form a connection between the two substrates. In order to assure a proper connection, it is necessary to align the substrates initially, but permit slight shifting of the two upon heating to allow for differences in alignment due to manufacturing tolerances.