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Separating the layers in peel-a-part copper which is used to fabricate printed circuit boards can be facilitated by applying a fluid at the point where the two layers are being separated.
English (United States)
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Peel A Part Copper Wet Peel Apparatus
Separating the layers in peel-a-part copper which is used to fabricate printed
circuit boards can be facilitated by applying a fluid at the point where the two
layers are being separated.
The device shown above facilitates the application of liquid as the layers of
peel-a-part copper are being separated. The mechanism includes a stand or
holder 10 with a slot 11 where a circuit board 12 can be positioned. The top
layer of the peel-a-part copper is attached to drum 15 which is rotated by motor 16. Fluid dispenser 20 applies an appropriate fluid where the peel-a-part carrier
layer 30 is separated from the bottom layer 31 of the peel-a-part copper.
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