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Browse Prior Art Database

Peel A Part Copper Wet Peel Apparatus

IP.com Disclosure Number: IPCOM000045043D
Original Publication Date: 1983-Jan-01
Included in the Prior Art Database: 2005-Feb-06

Publishing Venue

IBM

Related People

Authors:
McBride, DG Tucek, P [+details]

Abstract

Separating the layers in peel-a-part copper which is used to fabricate printed circuit boards can be facilitated by applying a fluid at the point where the two layers are being separated.