Semiconductor Wafer Processing
Original Publication Date: 1983-Jan-01
Included in the Prior Art Database: 2005-Feb-06
The succession of steps in this process improves the surface characteristics of wafers sliced from a rod of semiconductor crystal. The process steps comprise: 1. Grinding the crystal face to the desired geometry. 2. Using the thus-ground face to longitudinally index the crystal in the wafer-slicing machine. 3. Using the ground surface of the wafer to orient and mount the severed wafer for grinding and polishing the sawn surface. 4. Repeating steps 1 through 3 for each successive wafer.