Dismiss
The InnovationQ application will be updated on Sunday, May 31st from 10am-noon ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

Semiconductor Wafer Processing

IP.com Disclosure Number: IPCOM000045071D
Original Publication Date: 1983-Jan-01
Included in the Prior Art Database: 2005-Feb-06

Publishing Venue

IBM

Related People

Authors:
Strudwick, TH Wisdo, W [+details]

Abstract

The succession of steps in this process improves the surface characteristics of wafers sliced from a rod of semiconductor crystal. The process steps comprise: 1. Grinding the crystal face to the desired geometry. 2. Using the thus-ground face to longitudinally index the crystal in the wafer-slicing machine. 3. Using the ground surface of the wafer to orient and mount the severed wafer for grinding and polishing the sawn surface. 4. Repeating steps 1 through 3 for each successive wafer.