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Packaging Structure with the Ground Plane on Top of the Wiring Disclosure Number: IPCOM000045075D
Original Publication Date: 1983-Jan-01
Included in the Prior Art Database: 2005-Feb-06

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Geldermans, P [+details]


Described is a technique for planarization of fine line wiring and wire bonding, and deleting problems on polyimide coatings. In order to obtain more powerful wiring capability, one needs a fine line capability (etched) on top of multilayer ceramic (MLC). In this kind of structure there is a need for a ground or reference plane in order to reduce the noise and provide a controlled line impedance. A natural way to obtain this impedance would be to make a continuous ground plane.