Browse Prior Art Database

Chip Cooling Structure

IP.com Disclosure Number: IPCOM000045089D
Original Publication Date: 1983-Jan-01
Included in the Prior Art Database: 2005-Feb-06

Publishing Venue

IBM

Related People

Authors:
Mansuria, MS Meagher, RE Ostergren, CD [+details]

Abstract

A right-angled, hinged, heat transfer member with a spring disposed at 45 degrees with respect to the right angle provides intimate resilient contact with both the chip and the heat sink.