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Chip Cooling Structure Disclosure Number: IPCOM000045089D
Original Publication Date: 1983-Jan-01
Included in the Prior Art Database: 2005-Feb-06

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Related People

Mansuria, MS Meagher, RE Ostergren, CD [+details]


A right-angled, hinged, heat transfer member with a spring disposed at 45 degrees with respect to the right angle provides intimate resilient contact with both the chip and the heat sink.