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Lift Off Process for Producing a Dense Metallization Pattern

IP.com Disclosure Number: IPCOM000045104D
Original Publication Date: 1983-Jan-01
Included in the Prior Art Database: 2005-Feb-06

Publishing Venue

IBM

Related People

Authors:
Greschner, J Trumpp, HJ [+details]

Abstract

By decoupling the vertical and lateral etching during the production of a lift-off mask, the required spacing between adjacent metal lines is reduced to 1 to 2 Mum.