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Vapor Phase Contact Reflow Soldering

IP.com Disclosure Number: IPCOM000045129D
Original Publication Date: 1983-Feb-01
Included in the Prior Art Database: 2005-Feb-06

Publishing Venue

IBM

Related People

Authors:
Kelley, FJ [+details]

Abstract

This apparatus for closed loop cycle operation in vapor generation, application and recovery is desirable for soldering contact structures on edge card connectors. Fluid is drawn from a supply tank into a boiling chamber, and the resulting vapor is then drawn into a working chamber having a slot in one side sealed by flexible lips of suitable material. The card to be worked is partially inserted by way of the lips, and soldering takes place. Most of the vapor is liquified in the soldering process. This liquid is pumped out, scrubbed and returned to the supply tank.