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Telfon Polymer Mask for RIE of Contact Holes

IP.com Disclosure Number: IPCOM000045141D
Original Publication Date: 1983-Feb-01
Included in the Prior Art Database: 2005-Feb-06

Publishing Venue

IBM

Related People

Authors:
Ephrath, LM [+details]

Abstract

This publication describes a technique which overcomes the problem of thermal degradation of resist during the RIE (reactive ion etching) of contact holes due to poor adhesion of resist or a high flux of energetic etching specie.