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Laser Micromachining of Cured Polymides

IP.com Disclosure Number: IPCOM000045143D
Original Publication Date: 1983-Feb-01
Included in the Prior Art Database: 2005-Feb-06

Publishing Venue

IBM

Related People

Authors:
Moskowitz, PA Vigliotti, DR Gutfeld Von, RJ [+details]

Abstract

Polyimides are increasingly being used in packaging because of their temperature stability, flexibility, and relative chemical inertness. They may be etched prior to curing by KOH or NaOH solutions. However, after curing by heat treatments or chemical processes, the polymerized material is relatively inert to further chemical action. In order to etch the cured polyimide, reactive ion etching or mechanical machining is required.