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Browse Prior Art Database

Field Assist Thermal Compression Bonds

IP.com Disclosure Number: IPCOM000045144D
Original Publication Date: 1983-Feb-01
Included in the Prior Art Database: 2005-Feb-06

Publishing Venue

IBM

Related People

Authors:
Bogardus, EH Lane, R [+details]

Abstract

A major problem in the fabrication of a multinozzle ink jet assembly is the ability to bond a nozzle array to a support plate with a corrosion resistant material. All epoxies degrade with time and solder glasses are readily attacked by alkaline inks. A typical field assist bond between a metal or silicon and PYREX (Trademark of Corning Glass Works) can be made at 300 degrees C and 500 volts, and temperatures as low as 200 degrees C are possible.