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Circuit Personalization on Polyimide

IP.com Disclosure Number: IPCOM000045146D
Original Publication Date: 1983-Feb-01
Included in the Prior Art Database: 2005-Feb-06

Publishing Venue

IBM

Related People

Authors:
Fern, RE Perry, PB Ray, SK [+details]

Abstract

Localized line deletion for circuit personalization or defect repair is required for chip and high-density package technologies. The different levels of thin film circuitry are separated by an insulating layer. A material for this insulating layer is polyimide.