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MLC Laser Sizing Dual Mode Cutting

IP.com Disclosure Number: IPCOM000045211D
Original Publication Date: 1983-Feb-01
Included in the Prior Art Database: 2005-Feb-06

Publishing Venue

IBM

Related People

Authors:
Chiaiese, VC Tompkins, RE [+details]

Abstract

A CO(2) circulating gas laser, rated at 1.2 kW, continuously discharging infrared laser radiation at a wavelength of 10.6 Mum, is used, is used to cut multilayer "unfired" ceramic substrates. The laser beam has a diameter of 0.0254 cm (0.010 in.) and is stationary. The laminate, mounted on a vacuum chuck assembly, is indexed under the laser beam at table speeds of 101.6 - 317.5 cm (40 - 125 in.) per minute. The required substrate tolerances are +0.0051 cm (0.002 in.) for X,Y dimensions and +/- 0.0076 cm (0.003 in.) for feature to edge centrality.