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The effective area of orthogonal conductive grids for testing the integrity of intervening insulation is increased by the deposition of a thin aluminum layer on one of the grids.
English (United States)
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Test Site to Increase Effective Cross Over Area for Insulation Integrity
The effective area of orthogonal conductive grids for testing the integrity of
intervening insulation is increased by the deposition of a thin aluminum layer on
one of the grids.
A problem encountered in multilevel chip design is that of measuring the
insulation integrity. To do this, the metal grids are superimposed, one on top of
another on a chip test site. A continuity check is used to determine the insulator
integrity. The effective grid area is the cross-over area. A plate cannot be used
to increase effective cross-over area, since the topology of the metal is critical in
determining insulator integrity.
In order to improve effective cross-over area while maintaining the topology,
a thin film of metal (A1) approx. 1O00 Angstroms thick is deposited onto the
normal grid, as shown. This permits interlevel shorts to be found anywhere over
the entire area of the grid, not just at the cross-over area. Since the metal film
area is so large, complete coverage (e.g., at steps) is not necessary in order to
get good results.
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