Electroless Plating Rate Monitor
Original Publication Date: 1983-Mar-01
Included in the Prior Art Database: 2005-Feb-06
This monitor allows nearly continuous measurement of electroless metal deposition in an aqueous environment. The monitor includes a substrate 10 on which a solid copper section 12 is deposited, along with several copper lines 14, 16, 18, 20, 22, 24, and 26. Contact pads are located at the ends of the lines 14-26, so that electrical connections can be made to a recorder 28 and a AC scanner 30. Substrate 10 is a smooth inert material, such as glass, silicon, ceramic, epoxy, polypropylene, etc. The substrate material is chosen as one which is not attacked by the electroless plating bath and, for copper plating, glass or silicon will not be used. The spacing between each of the lines 14-26 is variable, as is the spacing between the ends of the lines 14-26 and the solid copper section 12.