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Electrochemical Method for Evaluating Pd Sn Activators for Electroless Deposition

IP.com Disclosure Number: IPCOM000045336D
Original Publication Date: 1983-Mar-01
Included in the Prior Art Database: 2005-Feb-06

Publishing Venue

IBM

Related People

Authors:
Horkans, WJ [+details]

Abstract

The fabrication of many types of microelectronic components (as well as other kinds of products) entails the use of electroless metal deposition. When the part to be plated is a nonconductor, the surface must first be activated with a catalyst that will initiate the electroless deposition process. In the past, the activation was achieved in a two-step process, in which the surface was first sensitized with a SnCl(2) solution or colloidal suspension, and then activated by a PdCl(2) solution. The two-step activation has now been largely supplanted by a one-step procedure, in which the surface is immersed in a suspension of a mixed colloid of Pd and Sn. The one-step activation is often followed by an acceleration step, which removes some of the tin from the activated surface.