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Browse Prior Art Database

Chip on Chip Module for Assembly

IP.com Disclosure Number: IPCOM000045461D
Original Publication Date: 1983-Mar-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Spector, CJ Stoller, HI [+details]

Abstract

This chip-on-chip interconnection technique uses tab bonding or solder-ball bonding or back bonding, at the option of the designer, to connect the 'master' chip to the module. However, the slave chip always is directly connected to the master chip via-solder ball bonding. The direct solder-ball interconnections between chips introduce minimal delay, eliminate the need for external driver-receiver circuits for interconnections between chips and avoid thermal mismatch problems.