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Soft Contact Loading of Wafer In Exposure Tool

IP.com Disclosure Number: IPCOM000045593D
Original Publication Date: 1983-Apr-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Gagne, M Phenix, R [+details]

Abstract

This article discloses an apparatus for aligning wafers in photomask exposure tools. In the figure there is shown a sectional view of a chuck assembly 10 containing a wafer-holding puck 11 which is supported in the chuck assembly 10 by a plurality of bellows 12. The wafer 13, which is to be placed in contact with an exposure ring 14 is maintained on the puck 11. In operation the wafer is mounted on the puck 11 and held there by suitable vacuum means or the like (not shown). The puck and wafer are then retracted into the interior of the chuck assembly by evacuating and collapsing the bellows 12. The chuck assembly 10 is then brought Into position on the frame around the ring 14 and locked thereon by suitable vacuum means.