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Porous Copper Billet Fabrication

IP.com Disclosure Number: IPCOM000045606D
Original Publication Date: 1983-Apr-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Moore, RJ Singer, J [+details]

Abstract

Chip sites on circuit modules can be dressed for the reattachment of chips by a copper billet having a silicon backing which enables closer monitoring of the site temperature, less copper oxidation, and the prevention of flux fumes flowing to the heat source.