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Browse Prior Art Database

Hermetic Sealing of IC Chips

IP.com Disclosure Number: IPCOM000045779D
Original Publication Date: 1983-Apr-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Marks, R Phelps, DW Samuelsen, SJ Ward, WC [+details]

Abstract

In the packaging art of connecting an integrated circuit (IC) chip to a substrate, one technique commonly used is wire bonding. In this technique an aluminum or gold wire is bonded to the top surface metallization, usually through vias formed in an overlying passivating layer, such as quartz. One problem with this technique is the susceptibility of such a connection to damage of the exposed metal by moisture in the ambient atmosphere. Encapsulation in a plastic is some help, but does not completely alleviate the problem.