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Deposition of Low Aspect Ratio Gold Studs by Pulse Plating

IP.com Disclosure Number: IPCOM000045792D
Original Publication Date: 1983-Apr-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Dibble, EP Lynch, TE [+details]

Abstract

A printer head carrying photoresist ovals on base copper was plated with 2 mils of gold by pulse plating. The center of the photoresist had a dimension of .005" x .007". The area of the head was approximately 1 in./2/. A thief area of an additional 2 in./2/ was employed. The part was plated with "hard" gold. Plating conditions were: Temperature............130 degrees F Agitation..............vigorous Pulse Current..........1.5 Amps Dutt Cycle.............T (on)/T (off)=1m sec/20m sec x 100=5% Current Density........4 ASF The benefits of pulse plating in this application are: 1. an increase in allowable current density for more rapid plating (successful pulse plates at 4 ASF, unsuccessful DC plates at less than 1 ASF); 2.