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Laminating Technique for Copper Inner Planes of Multilayer Printed Circuit Board

IP.com Disclosure Number: IPCOM000045793D
Original Publication Date: 1983-Apr-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Carey, TJ Samuelson, CE [+details]

Abstract

In producing multilayered printed circuit boards, it is necessary that each copper plane line up or register exactly with the copper planes above or below. The standard practice in registering the various copper per planes with each other is to use as many registration pins as required to meet the required tolerances. A "cold set" technique is proposed which insures that the parts, as they are aligned on the pins, do not move when heat and pressure are applied and maintain their initial registration. This technique provides a "cold set" at high pressure which preconditions the separating layers of glass cloth and resin to follow preinduced channels or stresses.