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Lead Copper Tin Co Evaporation Process System

IP.com Disclosure Number: IPCOM000045810D
Original Publication Date: 1983-Apr-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Brown, WW Cosgrove, JF Lupul, FT Wurms, C [+details]

Abstract

This article concerns apparatus and a method for depositing a lead, tin, copper alloy chip mount solder ball having reduced tendency for electromigration. The apparatus and method feature structure and steps for centrally locating a lead source in a vacuum chamber beneath the sample to be metallized. The lead source is flanked by a tin source on one side and a copper source on the other so that the combined sources may be co-evaporated.