High Low RIE Process
Original Publication Date: 1983-Apr-01
Included in the Prior Art Database: 2005-Feb-07
Use of high reactive ion etch (RIE) rates is desirable for deep etching, such as opening a deep isolation trench in silicon wafers to reduce the etch time. These high etch rates require higher power to the substrate electrode. However, high energy ion bombardment results in crystalline damage to the silicon wafer which is typically 10 to 20 nanometers deep. Thermal oxidation of this damaged silicon can result in stacking faults, which could, for example, traverse large distances and cause device degradation.