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These edge-connector patterns permit more densely spaced input/outputs (I/Os) in edge-connector applications.
English (United States)
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Dense Edge Connector Structures for Semiconductor Packages
These edge-connector patterns permit more densely spaced input/outputs
(I/Os) in edge-connector applications.
Edge-connector pads, as disclosed in Fig. 1, are a common and economical
method for providing continuity between a ceramic card or other material and a
board assembly. Via 10 in Fig. 1, associated with the internal metallurgy of the
substrate or card, is connected to larger area contacts 12 which make contact
with the associated boards. When using a card made by a multilayer ceramic
process, including cofired metallurgy, the shrinkage tolerance limits the number
of pads which can be used. The pad must be sufficiently large to accommodate
the variation in shrinkage. This, in turn, decreases the I/O capability of the
In Fig. 2 there is illustrated a contact pad configuration that permits more
closely spaced via connectors 14. As shown, the contact pads 16 associated
with the respective via connection are triangular in shape. A double row of
connector pins associated with the board is required to make contact with this
connector pad configuration. The pins contact the pad near the larger base
portion of the pad, allowing an area of contact nearly twice the size of the
standard design. This permits easier manufacturability, more I/O capability, and
larger MLC (multilayer ceramic) cards.
In Fig. 3, there is illustrated another design for contact
pads which allows the same number of pads as the...