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Lithographic Method for Defining Edge Angles

IP.com Disclosure Number: IPCOM000045844D
Original Publication Date: 1983-Apr-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Greschner, J Mohr, T Trumpp, HJ Vettinger, P [+details]

Abstract

A multilayer resist structure is used in a reactive ion etch process. This process is used for layers in which edges with accurately defined edge angles are to he reproducibly fabricated.