Chip Locator Block with Vacuum Pencil Pick Up Point
Original Publication Date: 1983-Apr-01
Included in the Prior Art Database: 2005-Feb-07
After flip-chip-type semiconductor chips have been diced from their wafers, they are placed in a gravity feed track and aligned for pick-up by means of a vacuum pencil for placement on a contacter for testing. A problem has arisen in reliably orienting the chip prior to its pick-up by the vacuum pencil, and this problem is illustrated in Fig. 1.