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Protection of Underlying Structure in the Parylene or Polymer Patterning Process

IP.com Disclosure Number: IPCOM000045925D
Original Publication Date: 1983-May-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Yeh, JT [+details]

Abstract

Oxidizable areas uncovered during oxygen plasma patterning of (poly) para-xylylene film are protected by photoresist where oxidation might become a source of problems.