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Method of Joining Using Gold-Rich Braze Alloys in Conjunction With Thick Gold-Plated Surfaces Disclosure Number: IPCOM000045936D
Original Publication Date: 1983-May-01
Included in the Prior Art Database: 2005-Feb-07

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Ainslie, NG King, WJ Palmateer, PH Slayton, G Sullivan, JF [+details]


This article describes method of brazing electronic package components together such that the braze joints thus produced exhibit melting temperatures that are substantially higher than those of the original braze alloy used in the operation. This feature is especially important when the brazing operation produces a braze joint having a melting temperature that is normally lower than the temperature at which subsequent manufacturing operations must occur. An example is the brazing of nickel-plated metal parts to nickel-plated multilayered ceramic structures at 400ŒC using Au-20 wt % Sn braze alloy (melting point 280ŒC) prior to one or more 350ŒC chip-joining operations. The problem is that the braze joint experiences partial melting at 350ŒC with its many attendant undesirable effects, included among which are: