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Wafer Packaging and Wiring Method Disclosure Number: IPCOM000046012D
Original Publication Date: 1983-May-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue


Related People

Millham, EH Wheeler, DC [+details]


This article teaches a method whereby all chip pads on a wafer may be simultaneously reflowed to an interposer which can also be reflowed to a substrate to provide input-output connections to all functional chips on the wafer.