Browse Prior Art Database

Wafer Packaging and Wiring Method

IP.com Disclosure Number: IPCOM000046012D
Original Publication Date: 1983-May-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Millham, EH Wheeler, DC [+details]

Abstract

This article teaches a method whereby all chip pads on a wafer may be simultaneously reflowed to an interposer which can also be reflowed to a substrate to provide input-output connections to all functional chips on the wafer.