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Browse Prior Art Database

Electronic Package Pin Structure

IP.com Disclosure Number: IPCOM000046042D
Original Publication Date: 1983-May-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Ainslie, NG Palmateer, PH Potter, M [+details]

Abstract

Disclosed is a means of improving the reliability of I/O pins and the braze joints between these pins and electronic package structures.