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Double Cantilever Flip-Chip Resistor

IP.com Disclosure Number: IPCOM000046071D
Original Publication Date: 1983-May-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Aakalu, NG [+details]

Abstract

Described is a resistor chip which is cantilever mounted by attachment in its central portion. An S-shaped resistor film replaces the traditional rectangular shape film between the two electrodes. The electrodes are near the center of the chip, whereas in the traditional design they are at the two ends of the chip. The electrodes can be either solder coated and reflow attached to a substrate or silver epoxied to the substrate. Except for the part of the chip between the two electrodes, the chip is free to expand or contract. Only a third of the length of the chip is constrained, and hence this configuration provides higher thermal cycle life for the solder or epoxy connections.