Browse Prior Art Database

Simplified Trench Planarization Process

IP.com Disclosure Number: IPCOM000046112D
Original Publication Date: 1983-Jun-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Ho, CW Sun, CP [+details]

Abstract

This simplified trench planarization process (STPP) is a process for VLSI chip packaging. It provides a simple and clean process for fabrication of planar structures for thin film packaging. The STPP is described as follows: