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Pinning Technique for Large Substrates

IP.com Disclosure Number: IPCOM000046191D
Original Publication Date: 1983-Jun-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Darrow, RE Funari, J Larnerd, JD [+details]

Abstract

A general-purpose module (GPM) will combine a multilayer ceramic (MLC) substrate and a metallized ceramic (MC) top surface metallurgy. The MLC substrate will be relatively large and can vary in size. A low- cost pinning process is required for this type of module. The pinning process must be compatible with both MC and MLC and must be capable of pinning both pluggable and/or solderable substrates.