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Low Temperature, Low Cost Braze System for Electronic Packages

IP.com Disclosure Number: IPCOM000046203D
Original Publication Date: 1983-Jun-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Brofman, PJ [+details]

Abstract

A low temperature and low cost braze joint system has been developed that is suitable for joining metal to metallized ceramic packages. The braze joint system consists of a 38% Ag-33% Cu-29% In alloy jointed to nickel surfaces (plated, metallized or bulk).