Nucleation Treatment for Oxygen Precipitation in Silicon Wafers
Original Publication Date: 1983-Jun-01
Included in the Prior Art Database: 2005-Feb-07
Oxygen supersaturated silicon wafers with 23-33 ppm of oxygen are usually susceptible to precipitation upon heat treatments required for device fabrication. This precipitation achieved in a controlled manner is desirable in a device line for high Leakage Limited Yield (LLY). Depending on the variations in crystal growth conditions, some wafers in this concentration range, however, can be resistant to precipitation and, thus, lose valuable gettering properties.