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Tip Configurations for Microwelding

IP.com Disclosure Number: IPCOM000046210D
Original Publication Date: 1983-Jun-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Lakritz, MN Levine, EN Napier, J Reeber, MD [+details]

Abstract

One microweld process employs an electrical discharge between a laminated pair of small rectangular tips separated by a l-mil gap. The tips are in contact with the wire to be joined, and during the process the wire is melted and solidified, reflecting the shape of the tip used, as shown in Figs. lA-1D. One tip employed has the simple configuration shown in Fig. l, which was found to have problems of low pull strengths particularly in the extreme case of hot bonds which happened occasionally.