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Method of Producing Thin-Film Patterns

IP.com Disclosure Number: IPCOM000046231D
Original Publication Date: 1983-Jun-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Hafner, B Greschner, J Trumpp, HJ [+details]

Abstract

An organic etch mask with a vertical profile, which serves to dry etch aluminum, is produced in a trilayer process. The etch mask is highly resistant to chlorine-containing plasmas.