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Browse Prior Art Database

Input/Output Device Interconnections

IP.com Disclosure Number: IPCOM000046366D
Original Publication Date: 1983-Jul-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Cade, PE Moran, CW Sanford, JL [+details]

Abstract

A first semiconductor chip, in which is formed preferably light-emitting diodes, is mounted on, aligned and electrically interconnected with a second semiconductor chip, which may be a driver chip, via appropriate solder balls or pads located in recesses of the second chip.