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Circuit boards can be fabricated by laying insulated wires in a layer of adhesive material. Such circuit boards are generally termed encapsulated wire circuit boards.
English (United States)
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Encapsulated Wire Circuit Board
Circuit boards can be fabricated by laying insulated wires in a layer of
adhesive material. Such circuit boards are generally termed encapsulated wire
Such boards sometimes require components to be soldered on the surface of
the board. A larger area for soldering components to the surface of such boards
can be obtained by soldering "nails" into the holes in such boards and using the
head of the nail as a surface on which other components can be soldered.
Engineering changes can be made in such boards by determining the exact
location of the wire in the board by techniques such as X-ray and then utilizing a
fine drill to cut the wire at a predetermined location.
If such a board is made in a multilayer configuration, engineering changes
can be made in the board by covering the outside surface with a layer of
adhesive and then using conventional encapsulated wire circuit board technology
to affix wires to this external layer of adhesive.