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Mass Removal of Connectors From Printed Circuit Board

IP.com Disclosure Number: IPCOM000046382D
Original Publication Date: 1983-Jul-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Kohn, H [+details]

Abstract

An array of multiple pin connectors, such as the type described in U.S. Patent 3,915,537, are removed en masse from their respective plated through holes (PTHs) of a printed circuit board (PCB) in which they are solder bonded by casting the extended free end portions of the connector in an uncured epoxy mold. The epoxy is allowed to cure, resulting in a two-piece assembly, the PCB and cured epoxy, which are secured and held together by the connectors by virtue of their opposite ends being affixed in the PCB and cured epoxy, respectively. Thereafter, the assembly is immfiled in glycerine which is then heated to an appropriate temperature for an appropriate time to reflow the solder bond, but does not affect the epoxy bond, whereupon the two pieces are displaced away from each other.