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The surface of an epoxy resin glass fiber laminate is roughened by reactive ion etching in oxygen, using a film of metallic lands as an etch mask.
English (United States)
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Method of Improving the Adhesion of Copper on a Plastic Laminate
The surface of an epoxy resin glass fiber laminate is roughened by reactive
ion etching in oxygen, using a film of metallic lands as an etch mask.
Reactive ion etching of the epoxy resin in oxygen plasma is effected through
a film of metallic lands. The films 2 (Fig. 1), with a mean diameter of the metallic
lands of about 1 to 3 mm can be readily generated by vapor depositing metals
with a low melting point, such as tin or lead, on the epoxy resin substrate l.
For implementing the method according to Fig. 2, tin lands were
used. The etch process was effected using the following parameters:
Pressure: 43.2 mbar
Flow rate: 30 cm3/min.
Energy density: 0.2 Watt/cm2
Etch time: about 20 to 30 min.
Under these conditions, epoxy columns l (Fig. 2), tapered towards the
bottom, with diameters of 0.5 to 2.5 mm and a height of about 3 to 5 mm are
obtained. The metal lands 2 are stripped after reactive ion etching in an etch
After epoxy substrate l (Fig. 3) has been roughened, it is provided with a
copper film 3 by sputtering or electroplating. As a result of being embedded
between the epoxy resin columns tapered towards the bottom, the copper
adheres excellently to the epoxy resin substrate.
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