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Interferometric Etch End-Point Detection for Two-Component Materials

IP.com Disclosure Number: IPCOM000046432D
Original Publication Date: 1983-Jul-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Bayer, T Elsner, G Hinkel, H Kempf, J [+details]

Abstract

During etching, materials consisting of two components with a statistical microscopic grain distribution and different etch rates develop a surface roughness which is measured from the phase difference in a coherent light beam reflected at the different grain types.