Mechanical Stress Reduction in VLSI Chip Cooling Assemblies
Original Publication Date: 1983-Jul-01
Included in the Prior Art Database: 2005-Feb-07
The mechanical stress on a VLSI chip, which is caused by heat transferring material, such as grease or soft solder, indium, etc., in the gap between heat sink l and the VLSI chip (not shown), is to be reduced by a perforation of the heat sink surface contacting the chip surface. This perforation can be a pattern of holes 4 or a wire screen.