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Mechanical Stress Reduction in VLSI Chip Cooling Assemblies

IP.com Disclosure Number: IPCOM000046435D
Original Publication Date: 1983-Jul-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Gruber, H Pollmann, K Schettler, H Stadler, EE [+details]

Abstract

The mechanical stress on a VLSI chip, which is caused by heat transferring material, such as grease or soft solder, indium, etc., in the gap between heat sink l and the VLSI chip (not shown), is to be reduced by a perforation of the heat sink surface contacting the chip surface. This perforation can be a pattern of holes 4 or a wire screen.