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Fluid Assembly for High Speed Chip Cooling

IP.com Disclosure Number: IPCOM000046507D
Original Publication Date: 1983-Jul-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Eldridge, JM Petersen, KE [+details]

Abstract

This semiconductor device assembly is cooled by bonding a grooved (110) cooling chip to an active IC chip and by providing the inlet and outlet fluid ports on the opposite side of the chip, sealed to a fluid supply system built into the laminated semiconductor assembly itself.