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Pick-Up and Unloading of Disk Substrates

IP.com Disclosure Number: IPCOM000046513D
Original Publication Date: 1983-Jul-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Gonzales, LJ Walker, AC [+details]

Abstract

The pick-up device is attached to an air cylinder. The air cylinder is activated, and its rod extends. The pick-up fingers 11 of the pick-up device contact the inside diameter of a substrate 10 part, pivot on the dowel pins, and deflect the leaf springs. The part to be picked up then slips over the fingers until it reaches the shoulder 11a of each finger. At this point the cylinder rod has started to retract. Fully retracted, the part(s) will be resting on each finger's shoulder and will be held securely by the tension of the leaf springs 12. A number of parts can be accumulated on the pick-up device in this manner. The maximum number of parts is dependent upon the weight of the parts and the tension characteristics of the leaf springs.