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Automated MYLAR Removal and Disposal From Circuitized Panels

IP.com Disclosure Number: IPCOM000046561D
Original Publication Date: 1983-Aug-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Banks, WF Wilmoth, TL Winters, RJ [+details]

Abstract

The present article describes apparatus for implementing a method to automate the removal of MYLAR* during the circuit board manufacturing process. In the figure, circuit panel 2 travels on rails 4 in the direction of arrow 6. Panel 2 may have MYLAR film on one or both sides. Feed rollers 8 are used to transport panel 2 between roller pair 10 and 12. Roller pair 10 and 12 selectively are movable in a direction transverse to panel travel in order to bring adhesive material 14, supplied on rolls 16 and 24, into contact with the MYLAR film on panel 2. The adhesion strength is sufficient to overcome the attraction between the MYLAR and the panel. Adhesive material 14 is taken up on take-up rollers 18 and 26. The MYLAR film, shown in phantom at 22, can subsequently be disposed of along with adhesive material 14.