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Wire Bonding to Metallurgy Pads on a Ceramic Substrate

IP.com Disclosure Number: IPCOM000046610D
Original Publication Date: 1983-Aug-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue


Related People

Arnold, AF Harvilchuck, JM Interrante, MJ Lennon, WR [+details]


This process permits the attachment of wires to screened metal pads that lack a heavy gold surface layer. In this process wires to be bonded to pads are tacked in place with an ultrasonic bonder with the power increased from the standard 2.0 setting to 2.6 on the supply. Each ultrasonically tacked bond is then permanently secured in place with a microweld or a reliable bond.