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Used Electronic Module Pin Solder Dress Process Disclosure Number: IPCOM000046642D
Original Publication Date: 1983-Aug-01
Included in the Prior Art Database: 2005-Feb-07

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Dumaine, G Morand, C [+details]


Single-chip (or multi-chip) modules are commonly used in mass production especially for high performance computers, and the need for replacing one or more chips may arise in certain cases, for example, if found defective. In order to repair the module, it is desoldered from the printed card on which it was mounted, and then repaired. With VLSI chips, such a module may be very costly, so it is highly desirable to be able to remove all the solder remaining on the pins after the desoldering operation, to put it in such good condition that it may be used again. An alternative to the process of dressing of pins of used modules for further reworking, as described in the IBM Technical Disclosure Bulletin 24, 5170-5171, (March 1982) will be herein disclosed.